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Low MOQ for Teflon Pcb Manufacture - FPC with steinless steel stiffener – Pandawill

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Low MOQ for Teflon Pcb Manufacture - FPC with steinless steel stiffener – Pandawill Detail:

Product Details

Layers 2 layers
Board thickness 0.15MM
Material Polyimide
Copper thickness 1 OZ(35um)
Surface Finish ENIG  immersion gold 
Thickness of  the copper foil 18/18um
Cu plated thickness 35um
Hole Cu thickness 20um
PI thickness 25um
Coverlay thickness  37.5um 
Stiffener Steinless steel 0.2mm
Min Hole(mm) 0.25mm  
Min Line Width(mm) 0.15mm
Min Line Space(mm) 0.12mm
Solder Mask Yellow
 Legend Color White
Mechanical processing Laser Cutting
E-test Flying probe or Fixture
Acceptance standard IPC-6013B; IPC-A-600H; ASF-WI-QA012; IPC-TM-650
Application Telecom

1. Introduction

Flexible printed circuits

Flexible printed circuits have become established in recent years as a medium for circuits.

The main users of flexible printed circuits are the technological sectors which need the following characteristics and benefits:

Implementation of compact, complex assemblies which minimise size and weight

Dynamically and mechanically robust when bent

Defined characteristics of the circuit systems on the circuit board (impedances and resistances)

Reliability of the electrical connections by minimising the number of connections between the modules

Saving connectors and wiring, also cost-saving by lowering the costs for component placement and assembly

 

2. Materials

Flexible base material: As a base material, PANDAWILL uses exclusively polyimide film which, compared to the alternative PET and PEN films has the advantage of a high processing temperature range, unrestricted solderability as well as the large operating temperature range. Depending on the requirements for the product and process, differing versions of film are used.

Polyimide thickness   25 µm, 50 µm, 100 µm   PANDAWILL standard: 50 µm  
Copper   Single or double sided    
  18 µm, 35 µm, 70 µm   PANDAWILL standard: 18 µm or 35 µm  
  Rolled copper (RA)   Suitable for dynamic, flexible applications  
  Electrolytically deposited copper (ED)   Low elongation after fracture, only suited for static and semi-dynamic applications  
Adhesive systems   Acrylic adhesive   For dynamical, flexible applications, not UL 94 V-0 listed  
  Expoy adhesive   Limited dynamic flexibility, UL 94 V-0 listed  
  Adhesive free   PANDAWILL standard, high flexibility, chemical resistance, and is UL 94 V-0 listed  

Product detail pictures:

Low MOQ for Teflon Pcb Manufacture - FPC with steinless steel stiffener – Pandawill detail pictures

Low MOQ for Teflon Pcb Manufacture - FPC with steinless steel stiffener – Pandawill detail pictures


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