| Component Mounting Specification | Minimum Precision | 0201 |  |
| Maximum Height | 20mm | ||
| Minimum Spacing | BGA 0.4 Pitch | ||
| IC 0.3 Pitch | |||
| Board Specification | Maximum Size | 450 ╳ 730mm | |
| Board Thickness | 0.3~6mm | ||
| Board Type | Rigid Board, Flex Board and Rigid-flex Board | ||
| Type of Solder | HASL-free, HASL | ||
| SMT | POP, Bonding, Auto Plug-in | ||
| production capacity | THT:100,000/month | ||
| SMT:2,000,000/day | |||
| Testing Capability | AOI, X-ray Inspection, ICT Testing, Flying Probe Testing, Function test, burn-in test | ||
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