FPC/Rigid-Flex(capabilities)
Rigid PCB (capabilities)
FPC/Rigid-Flex(capabilities)
| Layer count | 1-28 layers |  |
| Laminates type | FR-4(High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Board thickness | 6-240mil | |
| Max Base copper weight | 210um (6oz) for inner layer 210um (6oz) for outer layer | |
| Min mechanical drill size | 0.2mm (0.008″) | |
| Aspect ratio | 12:1 | |
| Max panel size | Sigle side or double sides:500mm*1200mm, | |
| Multilayer layers:508mm X 610mm (20″ X 24″) | ||
| Min line width/space | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil | |
| Via hole type | Blind / Buried / Plugged(VOP,VIP…) | |
| HDI / Microvia | YES | |
| Surface finish | HASL | |
| Lead Free HASL | ||
| Immersion Gold (ENIG), Immersion Tin, Immersion Silver | ||
| Organic Solderability Preservative (OSP) / ENTEK | ||
| Flash Gold(Hard Gold plating) | ||
| ENEPIG | ||
| Selective Gold Plating, Gold thickness up to 3um(120u”) | ||
| Gold Finger, Carbon Print, Peelable S/M | ||
| Solder mask color | Green, Blue, White, Black, Clear, etc. | |
| Impedance | Single trace,differential , coplanar impedance controlled ±10% | |
| Outline finish type | CNC Routing; V-Scoring / Cut; Punch | |
| Tolerances | Min Hole tolerance (NPTH) ±0.05mm | |
| Min Hole tolerance (PTH) ±0.075mm | ||
| Min Pattern tolerance ±0.05mm |
Rigid PCB (capabilities)
| Sort | Item | Capability |  |
|
| Layer count | Rigid-flex PCB | 2 ～14 | ||
| Flex PCB | 1 ～10 | |||
| Board | Min. Thickness | 0.08 +/- 0.03mm | ||
| Max. Thickness | 6mm | |||
| Max. Size | 485mm * 1000mm | |||
| Hole & Slot | Min.Hole | 0.15mm | ||
| Min.Slot Hole | 0.6mm | |||
| Aspect Ratio | 10:1 | |||
| Trace | Min.Width / Space | 0.05 / 0.05mm | ||
| Tolerance | Trace W / S | ± 0.03mm | ||
| (W/S≥0.3mm:±10%) | ||||
| Hole to hole | ± 0.075mm | |||
| Hole Dimension | ± 0.075mm | |||
| Impedance | 0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω | |||
| Material | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Main supplier | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Coverlay Specification | PI : 2mil 1mil 0.5mil | |||
| LPI Color | Green / Yellow / White / Black / Blue / Red | |||
| PI Stiffener | T : 25um ～250um | |||
| FR4 Stiffener | T : 100um ～2000um | |||
| SUS Stiffener | T : 100um ～400um | |||
| AL Stiffener | T : 100um ～1600um | |||
| Tape | 3M / Tesa / Nitto | |||
| EMI shielding | Silver film / Copper / Silver ink | |||
| Surface finish | OSP | 0.1 - 0.3um | ||
| HASL | Sn : 5um - 40um | |||
| HASL(Leed free) | Sn : 5um - 40um | |||
| ENEPIG | Ni : 1.0 - 6.0um | |||
| Ba : 0.015-0.10um | ||||
| Au : 0.015 - 0.10um | ||||
| Plating hard gold | Ni : 1.0 - 6.0um | |||
| Au : 0.02um - 1um | ||||
| Flash gold | Ni : 1.0 - 6.0um | |||
| Au : 0.02um - 0.1um | ||||
| ENIG | Ni : 1.0 - 6.0um | |||
| Au : 0.015um - 0.10um | ||||
| Immesion silver | Ag : 0.1 - 0.3um | |||
| Plating Tin | Sn : 5um - 35um | |||