Design Capability
| Max design layers | 40 layers |
| Max pin count | 60,000 |
| Max connections | 40,000 |
| Minimum line width | 3 mil |
| Minimum line spacing | 3 mil |
| Minimum via | 6 mil (3 mil laser drill) |
| Maximum pin spacing | 0.44mm |
| Max power consumption/PCB | 360W |
| HDI Build | 1+n+1; 2+N+2, X+N+X, Any layer HDI in R&D |
Delivery Capability
| Pin amount | Delivery (Working Days) |
| 0-2,000 | 3-5 |
| 2,000-4,000 | 5-8 |
| 4,000-6,000 | 8-12 |
| 6,000-8,000 | 12-15 |
| 8,000-10,000 | 15-18 |
| 10,000-12,000 | 18-20 |
| 12,000-14,000 | 20-22 |
| 14,000-16,000 | 22-25 |